Pai Twister Polishing Pad: 30 (h) x 175 mm 1 Pc bag with blister Orange
Reduced Velcro: It is very easy to place the plate in the middle since it corresponds perfectly with the diameter of Velcro. Velcro basis never risks to be in contact with paint and ruin it
Rounded Angles: Easier and facilitated flowing Reduce particles’ over-splatting Reduced pressure on curved parts Less holograms
Through self-cooling system, our pad “TWISTER” allows you to work even at high speed and with quite strong pressure, without overheating the treated surface. Hot air is pushed outward by centrifugal force, creating a vacuum that sucks in fresh air from the top of the pad under back plate.
After a few moments of processing, residues of polishing materials bind with impurities of the treated surface, creating hard granules or balls, which roll under the pad and create circular scratches on the surface. The drilling system of our “TWISTER” pad let the balls or granules go into the holes and remain there blocked during the processing.
Back plate places perfectly in the centre of the pad quickly and easily, because of its selfpositioning system. This not only saves time, but above all lets you to avoid annoying vibrations during processing. Pad shifting also produces an oscillating movement that is too fast and works too much on the treated area leaving well-known holograms.
Because of its specific angled shape, “TWISTER” pad works easily on curved surfaces, which are more and more often according to new extreme designs, without impacting the area that has a different inclination. Pointed profile, not only can follow the curvature without removing pad from surface, but also reach the most difficult areas.